Electronic Packaging
This one-day seminar on the electronic packaging aspects of
EMC is intended for mechanical and electronic packaging engineers.
Emphasis is on proper shielding and enclosure design. In addition to enclosure shielding,
the subjects of cable penetrations, cable shielding, power line filter mounting, and electrostatic discharge protection
and testing are discussed. This seminar duplicates some material found in the
Shielding and ESD Protection in Equipment Design seminars.
Although primarily intended for mechanical engineers;
electrical engineers, technical managers, and technicians who want a better
understanding of electronic packaging have also found this material to
be useful.
Outline
SHIELDING
Shielding Basics
Shielding Effectiveness
-Absorption Loss
-Reflection Loss
Seams, Holes & Apertures
Surface Finishes for Metals
Screens & Meshes
Waveguides Below Cutoff
Conductive Coatings for Plastics
Selective Shielding
Grounding of Shields
Measuring Shielding Effectiveness
CABLE PENETRATIONS
Cable Treatment Guidelines
Cable Shield Terminations
Enclosure Voltages
Diagnostic Techniques
Connector Mounting & Grounding
Power Line Filter Mounting & Grounding
ELECTROSTATIC DISCHARGE CONSIDERATIONS
Human Body Model
Protection Methods
Metallic Enclosures
- Secondary Arcs
- Circuit/Enclosure Bonding
Interface Cable Treatment
- Shielding
- Transient Suppression
Plastic Enclosures
- Treatment of I/O Ports
- ESD Ground PLate
- Arcing Distances
Control Panels/Keyboards
ESD Testing
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Henry Ott Consultants
48 Baker Road Livingston, NJ 07039
Phone: 973-992-1793, FAX: 973-533-1442
e-mail: h.ott@att.net
April 24, 2009