EMC ASPECTS OF HIGH SPEED ASIC DESIGN

Larger, faster Integrated Circuits have become significant sources of electromagnetic radiation in recent years as clock speeds have exceeded 100 MHz and IC power dissipation has increased dramatically.  It is not at all unusual today to have the emission from a single IC exceed the allowable regulatory limit for radiation.  Technology has now advanced to the point where we can no longer limit EMC control to the system level, printed circuit board, and cables.  Today we must also consider EMC as part of the design and packaging of Integrated Circuits.

This one-day course covers the basic principles of electromagnetic compatibility (EMC) control and how they can be applied to the design and packaging of Application Specific Integrated Circuits (ASIC).  The sources and mechanisms of digital logic noise and radiation will be explained and various noise reduction techniques examined.  Topics discussed include: techniques for minimizing inductance, on-chip clock routing guidelines, clock edge-rate control, clock dithering, crosstalk control, package pin-out guidelines, ground bounce, signal to ground pin ratio, and proper high-speed decoupling.  In addition,  standardized methods for measuring IC radiation, independent of the PCB radiation, are also presented.  The principles presented will be illustrated with examples and actual case histories of  reduced emission IC designs.  Although ASICs are emphasized, the principles covered apply equally to the design of any Integrated Circuit.

 This course is designed for Product Designers, System Engineers, ASIC Designers, and anyone who is interested in applying EMC principles at the IC level.  In addition, anyone responsible for defining the technical requirements for an ASIC will benefit from this course.  No prior  EMC knowledge is required of the attendees.  The participants will receive the knowledge necessary to design ASICs which have reduced radiated emissions.   Attendees will receive a set of  lecture notes (>100 pages) which includes an extensive bibliography (> 40 references) which can be used for additional study on the subject.


Outline

REVIEW OF BASIC EMC PRINCIPLES

 Noise Generation Mechanisms
 Digital Circuit Layout Requirements
 The Importance of Reducing Inductance
 Decoupling Principles
 Basic Principles of EMC
 Radiation Mechanisms
 Controlling Radiation Radiation
 

APPLICATION OF EMC PRINCIPLES TO ASIC DESIGN

 IC Radiation Mechanisms
 Synchronous Vs Asynchronous Signals
 High-Speed Decoupling
 In-Package Decoupling
 IC Package Inductance
 Interdigitated Leads
 Package Pin-Out Guidelines
 High Density Packaging
 

ASIC DESIGN PRINCIPLES

 Vdd Isolation
 Heatsink Radiation
 Magnetic Field Coupling
 Clock Routing
 Clock Edge-Rate Control
 Clock Dithering
 Crosstalk
 IC Pin-outs
 PCB Considerations
 Antennas
 Ground Bounce Control
 Signal to Ground Pin Ratio
 Soft Drive Output Buffers
 Heat Sink Radiation
 Ferrite Suppressors
 Controlling IC Radiation
 

MEASURING RADIATION FROM ICs

 Emission Test Standards
 Emission Test Set-Up
 Magnetic Field Probe Method
 TEM Cell Method
 Ground Voltage/Current Method
 Magnetic Dipole Moment



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Henry Ott Consultants
48 Baker Road Livingston, NJ 07039
Phone: 973-992-1793,   FAX: 973-533-1442
e-mail: h.ott@att.net

July 10, 2002