EMC ASPECTS OF HIGH SPEED ASIC DESIGN
Larger, faster Integrated Circuits have become significant sources of electromagnetic
radiation in recent years as clock speeds have exceeded 100 MHz and IC
power dissipation has increased dramatically. It is not at all unusual
today to have the emission from a single IC exceed the allowable regulatory
limit for radiation. Technology has now advanced to the point where
we can no longer limit EMC control to the system level, printed circuit
board, and cables. Today we must also consider EMC as part of the
design and packaging of Integrated Circuits.
This one-day course covers the basic principles of electromagnetic compatibility
(EMC) control and how they can be applied to the design and packaging of
Application Specific Integrated Circuits (ASIC). The sources and
mechanisms of digital logic noise and radiation will be explained and various
noise reduction techniques examined. Topics discussed include: techniques
for minimizing inductance, on-chip clock routing guidelines, clock edge-rate
control, clock dithering, crosstalk control, package pin-out guidelines,
ground bounce, signal to ground pin ratio, and proper high-speed decoupling.
In addition, standardized methods for measuring IC radiation, independent
of the PCB radiation, are also presented. The principles presented
will be illustrated with examples and actual case histories of reduced
emission IC designs. Although ASICs are emphasized, the principles
covered apply equally to the design of any Integrated Circuit.
This course is designed for Product Designers, System Engineers,
ASIC Designers, and anyone who is interested in applying EMC principles
at the IC level. In addition, anyone responsible for defining the
technical requirements for an ASIC will benefit from this course.
No prior EMC knowledge is required of the attendees. The participants
will receive the knowledge necessary to design ASICs which have reduced
radiated emissions. Attendees will receive a set of lecture
notes (>100 pages) which includes an extensive bibliography (> 40 references)
which can be used for additional study on the subject.
Outline
REVIEW OF BASIC EMC PRINCIPLES
Noise Generation Mechanisms
Digital Circuit Layout Requirements
The Importance of Reducing Inductance
Decoupling Principles
Basic Principles of EMC
Radiation Mechanisms
Controlling Radiation Radiation
APPLICATION OF EMC PRINCIPLES TO ASIC DESIGN
IC Radiation Mechanisms
Synchronous Vs Asynchronous Signals
High-Speed Decoupling
In-Package Decoupling
IC Package Inductance
Interdigitated Leads
Package Pin-Out Guidelines
High Density Packaging
ASIC DESIGN PRINCIPLES
Vdd Isolation
Heatsink Radiation
Magnetic Field Coupling
Clock Routing
Clock Edge-Rate Control
Clock Dithering
Crosstalk
IC Pin-outs
PCB Considerations
Antennas
Ground Bounce Control
Signal to Ground Pin Ratio
Soft Drive Output Buffers
Heat Sink Radiation
Ferrite Suppressors
Controlling IC Radiation
MEASURING RADIATION FROM ICs
Emission Test Standards
Emission Test Set-Up
Magnetic Field Probe Method
TEM Cell Method
Ground Voltage/Current Method
Magnetic Dipole Moment
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Henry Ott Consultants
48 Baker Road Livingston, NJ 07039
Phone: 973-992-1793, FAX: 973-533-1442
e-mail: h.ott@att.net
July 10, 2002